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| ILX553B 5150-pixel CCD Linear Sensor (B/W) Description The ILX553B is a reduction type CCD linear sensor developped for DPPC, multifunction printers. This sensor reads A4-size documents at a density of 600 DPI at high speed of 16MHZ. Features * Number of effective pixels: 5150 pixels * Pixel size: 7m x 7m (7m pitch) * Clamp circuit is on-chip * Ultra high sensitivity/Ultra low lag * Maximum data rate: 16MHz * Single 12V power supply * Input clock pulse: CMOS 5V drive * Package: 22 pin Plastic DIP (400mil) Absolute Maximum Ratings * Supply voltage VDD * Operating temperature * Storage temperature Pin Configuration (Top View) 22 pin DIP (Plastic) Block Diagram 16 ROG 15 2 Driver Read out gate GND GND GND GND VOUT VDD GND 1 GND 1 1 2 3 4 5 6 7 8 9 22 GND 21 GND 20 LH 19 RS 18 GND LH 20 D14 D15 D63 S1 17 CLP 16 ROG CCD register VDD 15 2 14 GND 13 GND 12 GND GND 10 5150 GND 11 Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E01Y36 VOUT 5 CLP RS 6 17 19 S5150 D64 D 15 -10 to +60 -30 to +80 V C C 1 8 ILX553B Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 Symbol GND GND GND GND VOUT VDD GND 1 GND GND GND GND GND GND GND Signal out 12V power supply GND Clock pulse input GND GND GND Description Pin No. 12 13 14 15 16 17 18 19 20 21 22 Symbol GND GND GND 2 ROG CLP GND RS LH GND GND GND GND GND Clock pulse input Clock pulse input Clock pulse input GND Clock pulse input Clock pulse input GND GND Description Recommended Supply Voltage Item VDD Min. 11.4 Typ. 12.0 Max. 12.6 Unit V Clock Characteristics Item Input capacity of 1, 2 Input capacity of LH1 Input capacity of RS1 Input capacity of CLP1 Input capacity of ROG Symbol C1, C2 CLH CRS CCLP CROG Min. -- -- -- -- -- Typ. 400 10 10 10 10 Max. -- -- -- -- -- Unit pF pF pF pF pF Clock Frequency Item 1, 2, LH, RS, CLP Symbol f1, f2, fLH, fRS, fCLP Min. -- Typ. 1 Max. 16 Unit MHz Input Clock Pulse Voltage Condition Item 1, 2, LH, RS, CLP ROG , pulse voltage High level Low level Min. 4.75 0 Typ. 5.0 -- Max. 5.25 0.1 Unit V V -2- ILX553B Electrooptical Characteristics (Note 1) Ta = 25C, VDD = 12V, fR = 2MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm) Item Sensitivity Sensitivity nonuniformity Saturation output voltage Saturation exposure Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level R PRNU VSAT SER VDRK DSNU IL IVDD TTE ZO VOS Symbol Min. 11.8 -- 1 -- -- -- -- -- 92 -- -- Typ. 14.8 4 2 0.14 0.3 0.6 0.02 15 98 230 6.2 Max. 17.8 10 -- -- 2 3 -- 30 -- -- -- Unit V/(lx * s) % V lx * s mV mV % mA % V Remarks Note 2 Note 3 Note 4 Note 5 Note 6 Note 7 -- -- -- Note 8 Notes 1) In accordance with the given electrooptical characteristics, the even black level is defined as the average value of D14, D15, to D62. 2) For the sensitivity test light is applied with a uniform intensity of illumination. 3) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT = 500mV (Typ.) PRNU = (VMAX - VMIN)/2 x 100 [%] VAVE The maximum output of 5150 pixels is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4) Use below the minimum value of the saturation output voltage. 5) Saturation exposure is defined as follows. SE = VSAT R 6) Optical signal accumulated time int stands at 10ms. 7) VOUT = 500mV (Typ.) 8) VOS is defined as indicated bellow. VOUT VOS GND -3- Clock Timing Chart 1 ROG 5 0 3 1 LH 2 5 0 5 0 RS 5 0 5 S5149 S5148 S5150 CLP 0 D15 D61 D62 D13 D14 D63 D1 D2 D3 S1 S2 1 2 4 D64 VOUT Optical black (49 pixles) Dummy signal (63 pixles) 1-line output period (5220 pixles) Note) The transfer pulses (1, 2, LH) must have more than 5220 cycles. D65 -4- ILX553B ILX553B Clock Timing Chart 2 t4 ROG t2 t6 1 LH t7 t5 t1 t3 2 Clock Timing Chart 3 t7 1 LH t6 2 t10 t9 RS t8 t11 t14 t13 CLP t12 t15 t16 VOUT t17 -5- ILX553B Clock Timing Chart 4 Cross point 1 and 2 1 5V 1.5V (Min.) 2 0V 1.5V (Min.) Cross point LH and 2 2 5V 2.0V (Min.) LH 0V 0.5V (Min.) -6- ILX553B Clock Pulse Recommended Timing Item ROG, 1 pulse timing ROG pulse high level period ROG, 1 pulse timing ROG pulse rise time ROG pulse fall time 1 pulse rise time/2 pulse fall time 1 pulse fall time/2 pulse rise time RS pulse high level period RS, CLP pulse timing RS pulse rise time RS pulse fall time CLP pulse high level period CLP LH pulse timing , CLP pulse rise time CLP pulse fall time Signal output delay time Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 Min. 50 3 1 0 0 0 0 (10) (10) 0 0 (20) (5) 0 0 -- -- Typ. 100 5 2 5 5 20 20 2001 2001 10 10 2001 501 10 10 15 8 Max. -- -- -- 10 10 60 60 -- -- (30) (30) -- -- (30) (30) -- -- Unit ns s s ns ns ns ns ns ns ns ns ns ns ns ns ns ns 1 These timing is the recommended condition under fRS = 1MHz. -7- Application Circuit LH RS CLP ROG 2 IC2 IC2 IC1 100 100 100 100 2 22 21 20 19 18 17 16 15 14 13 12 ROG RS CLP GND GND GND GND GND VOUT GND GND GND GND GND GND GND 1 2 3 4 5 6 7 8 9 10 11 12V 100 Tr1 GND VDD 1 GND LH 2 -8- 2 47F/16V 0.1F IC1 VOUT 5.1k 1 Data rate fRS = 1MHz IC1: 74AC04 IC2: 74HC04 Tr1: 2SC2785 ILX553B Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. ILX553B Example of Representative Characteristics (VDD = 12V, Ta = 25C) Spectral sensitivity characteristics (Standard characteristics) 1.0 0.9 0.8 0.7 Relative sensitivity 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 Wavelength [nm] 800 900 1000 Dark signal output temperature characteristics (Standard characteristics) Integration time output voltage characteristics (Standard characteristics) 10 5 Output voltage rate Output voltage rate 30 40 50 60 1 1 0.5 0.5 0.1 0 10 20 0.1 1 5 int - integration time [ms] 10 Ta - Ambient temperature [C] Offset level vs. VDD characteristics (Standard characteristics) Ta = 25C 10 Offset level vs. Temperature characteristics (Standard characteristics) 10 VOS - Offset level [V] 8 VOS - Offset level [V] VOS -2mV/C Ta 8 6 4 VOS 0.6 VDD 2 6 4 2 0 11.4 12.0 VDD [V] 12.6 0 0 10 20 30 40 50 60 Ta - Ambient temperature [C] -9- ILX553B Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Cover glass Plastic portion 39N 29N 29N 0.9Nm Ceramic portion (1) Adhesive (2) (3) (4) b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. d) The notch of the plastic portion is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap with the notch of the plastic portion. - 10 - ILX553B 3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W soldering iron with a ground wire and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. - 11 - Package Outline Unit: mm 22 pin DIP (400mil) 55.7 0.3 10.6 0.3 36.05 (7m X 5150pixels) 22 12 5.0 0.3 10.0 0.3 V H 1 53.00 ( 4.55 ) No.1 Pixel 11 10.16 7.3 4.0 0.5 2.54 0.3 M 0.51 1. The height from the bottom to the sensor surface is 2.38 0.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5. PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS DRAWING NUMBER Plastic, Ceramic GOLD PLATING 42 ALLOY 5.43g LS-B23-02(E) 4.28 0.5 3.58 0.25 0 to 9 - 12 - Sony Corporation ILX553B |
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